Routine testing

Epoxy resin - expansion measurement
The sample undergoes a linear expansion process before approximately 60 ° C, with an expansion coefficient of 1.58 × 10-4 1/K. After 60 ° C, the sample undergoes glass transition and the coefficient of expansion changes.

Natural Spider Silk - Stretching Measurement
The spider silk sample measured in the picture has a diameter of only 1um.

Multilayer film samples - needle in measurement
In needle insertion mode, the two-layer film sample showed a two-stage needle insertion process. After penetrating one layer, the dL curve of the single-layer film sample has flattened.

Special testing

Resin curing test
The test is conducted in the form of oscillatory force. Compared to 25 ° C, 56 ° C has a lower initial viscosity and larger amplitude of the sample; But solidification occurs earlier, and as solidification occurs, the amplitude rapidly decreases.

Epoxy resin - fixed deformation testing
As the temperature increases, the natural expansion trend of the sample becomes larger, and the force required to maintain a fixed compression deformation also increases accordingly. It is not until the sample undergoes glass transition from 58 ° C that the modulus of the sample decreases and the required load force decreases accordingly.

Polyimide - Measurement of Expansion under Humidity Atmosphere
The blue TMA curve in the figure not only displays the corresponding thermal expansion of the sample as the constant temperature increases (from 20 ° C to 85 ° C), but also shows the corresponding hygroscopic expansion process as the ambient humidity increases (from 5% to 70%, 85% relative humidity).